Job DescriptionWe are looking for a creative and passionate Optical Packaging Process Engineer working in an advanced development team in the CTO Office. In this highly visible role, you will develop and improve hybrid optoelectronics packaging process from concept to process flow implementation. By working with our optoelectronics integration team you will develop novel assembly processes at wafer scale to integrate InP, GaAs, SiP PIC and passive optical components with high yields and reliability. Candidates are expected to possess profound understanding, knowledge, and experience of key optoelectronic device processes, such as flip-chip die attach, Eutectic reflow, underfill material dispensing, 2.5D and 3D assembly at wafer scale. Knowledge and experience in optical coupling efficiency, signal integrity, and thermal modeling are great advantages. Candidates will work with internal engineering teams and external vendors to bring technology and components together required by the O/E hybrid integration platform. Key Responsibilities:Research and develop novel O/E integration package process solutions from concept to design verification for II-VI's next generation high speed optical subsystems such as co-packaged optical transceivers and multi-chip modules with InP, GaAs and silicon photonics components.Design multi-chip hybridized optoelectronic IC's integration processes. This integration process includes flip-chipped lasers, silicon photonic IC's, high speed analog and digital IC's on specialized substrates. Evaluate and specify lab equipment for wafer scale assembly processes, including die bonding, mass reflow, underfill, wafer dicing and part packaging.Design and conduct optical die attach and optical alignment between lasers, PIC's, and optical fibers. Design and conduct DOE's to improve accuracy, reliability, and efficiency. Co-design substrate die attach features such as solder pads, UBMs, solders, optical fiducials, with module designers and package designers. Evaluate and procure key materials such as optical adhesives, solders, fluxes, thermal compounds.Prepare and perform measurement and analysis of optical alignment, thermal efficiency, and mechanical stability with tolerance analysis and characterization.Design or specifying process required fixtures, tooling for flip-chip die attach and wafer scale assembly. Prepare process qualifications at both component level and subsystem levels by collaborating with quality team.Design and experiment for packaging reliability and perform Failure Mode Engineering Analysis (FMEA).Document key R results for IP protection as well as work instructions for operations.SKILLS & QUALIFICATIONS: Master's degree or higher in Applied Physics, Electronics Engineering, Optoelectronics Engineering, Material Science or related fields. Equivalent industry experience is also applicable.At least 2 years industry experience with optical systems assembly process development, including proficient thermal and stress simulation coupled with a deep understanding of thermal and stress issues and solutions.Hands on experience in cleanroom/lab in implementation and improvement of processes such as, but not limited to, flip-chip die bonding, wire bonding, epoxy bonding, eutectic reflow, soldering, lens placement, lens alignment, and active optical alignment.Hands on experiences in process debugging methods and tools such as cross-sectioning, visual inspection, metallurgical analysis, SEM, and other lab analysis instruments and equipment.Extensive knowledge and experience in material chemical and physical characteristics and their compatibility in die bounding and optical alignment.Ability of using thermal modeling and mechanical modeling tools for tolerance analysis, CTE mismatch analysis, and long-term reliability analysis.Experience with high-speed electronics package design and/or laser package design.Working knowledge experience in 2D, 2.5D, and 3D wafer scale assembly.Ability to design and manage internal and external vendors in manufacturing of fixtures and tooling required by assembly process.Experience with SolidWorks and thermal analysis tool.Proven track record for driving process characterization and reliability qual, as well as successful process transfer to manufacturing.Excellent oral and written communication and documentation skills. II-VI is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.