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Senior Packaging Engineer - 81753

Location
Santa Clara, California
Job Type
Permanent
Posted
15 Feb 2021
What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks for gaming, immersive platforms, and the data center. Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the "extra mile" to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.Senior Packaging Engineer Responsibilities Tasked with managing client packaging needs within AMD's packaging group. Responsible for developing and enabling Low Temp Solder technology on AMD's client BGA parts. Work extensively in conjunction with AMD's Advanced Packaging group to experiment and develop Low Temp Solutions on BGA parts that work seamlessly with customer's SMT and PCB systems. Partner with assembly subcons, solder ball vendors, and solder paste vendors to devise and select appropriate material solutions that meet or exceed intended package reliability and performance specs. Work closely with package reliability, assembly engineering, mechanical simulation group to chalk up package assembly DOE plans, coordinate assembly builds, scrutinize package qualification plans, monitor package reliability testing, failure analysis, and modify processes to meet the intended needs of long-term reliable performance packages. Solve technical issues on package reliability, materials, and assembly process by working closely with assembly and material suppliers. Work closely with PCB and SMT houses to design Package level reflow DOEs to fine tune package warpage control during reflow. Partner with Board OEM and ODM houses and internal board operations team to understand and study most common SMT problems/failures and devise solutions to eliminate the issues encountered. Skills & Experience Experience evaluating different packaging SMT materials such as solder ball alloys, solder pastes, flux etc. - hands-on experience dealing with SnBi based alloys preferred. Deep understanding of PCB and board assembly parameters and interaction with packages during reflow. Hands-on experience optimizing SMT reflow process parameters to reduce warpage coplanarity. Prior experience understanding solder joint reliability is a plus. Knowledge using CAD tools such as AUTOCAD, JMP. Experience dealing with assembly and substrate subcontractors. Excellent communication and organizational skills. Excellent team player who collaborates well with others. Some travel required (5-10%). Additional Responsibilities Represent the client packaging team and lead electronic packaging development projects such as SiP, MCM, flipchip BGA, CSP packaging, etc. concurrently. Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities. Utilize hands-on expertise of assembly processes for flip chip package development, lid and stiffener design, package material selection, assist in die placement studies and partner with designers on routing feasibility analysis. Manage project schedules, identifying risks and clearly presenting to project stakeholders. Create and drive team members to complete design, simulation, prototyping, test, integration, and delivery of samples and production ready technology and material. Work cross-functionally to understand trade-offs, constraints, and for optimize solutions to meet critical deadlines and deliverables. Define design process and methodologies to improve project efficiency. Education B.S or M.S. in Mechanical Engineering, Electrical Engineering, Computer Engineering, or Engineering Science #LI-RJ1 Requisition Number: 81753 Country: US State: CA City: Santa Clara Job Function: Packaging Engineering AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.
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Details

  • Job Reference: 232034715-2
  • Date Posted: 15 February 2021
  • Recruiter: Advanced Micro Devices
  • Location: Santa Clara, California
  • Salary: On Application
  • Sector: Manufacturing Operations
  • Job Type: Permanent