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Process Engineer - Advanced Packaging

Location
Santa Clara, California
Job Type
Permanent
Posted
15 Feb 2021
III. JOB DESCRIPTION INFORMATION - All fields must be completed. PURPOSE: The process engineer will be responsible for supporting our Die Attach and Wire Bond processes in both wafer and PCB scale assemblies in our advanced packaging Cleanroom. Who will take a hands-on and data driven approach to development, debugging, and continuous improvement.PRINCIPLE ACCOUNTABILITIES / DUTIES:Develop and refine assembly methodologies for process repeatability and robustness.Setup machine/process recipes for prototype/NPI samples and engineering test builds.Die Attach and Wire Bond recipes.Plasma cleaning recipes.Epoxy bake profile recipes.EncapsulationActive Optical AlignmentQualify in-house cleanroom prototype & pilot assembly for production release and support line transfer activities to high volume factories.Create and maintain process documents such as work instructions, engineering specifications, acceptance procedures and control plans.Evaluate process risk assessments of assembly steps and recommend actions to mitigate.Implement lean manufacturing practices.Develop standardized work instructions, implement 5S, balance lines, create process flow.Review manufacturing activities and make recommendations to reduce cost, improve setup/cycle times, remove non-value added activities from the manufacturing process.Address process excursions/issues with a systematic approach to problem solving and statistical analysis.Drive DOE studies for process optimization and root cause analysis efforts.Prepare various test/8D/MRB reports and present to the technical team/management for recommended actionsPREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc) Minimum 3 years of hands-on process engineering experience in micro-electronic device assembly and/or opto-electronics manufacturing environment with automated equipment experience such as die attach and/or wirebond is required.PREFERRED Qualifications (nice to have skills): 1. Strong problem-solving skills using 8D method and sound engineering approach to decision making.2. Experience leading PFMEA efforts and constructing control plans.3. Experience working with various type adhesives and dispense methods such as time/pressure, positive displacement, stamping, and jetting.4. Good understanding of GR, CpK, correlation, and process control related statistical analysis.5. Must be a self-starter to manage projects/tasks from beginning to completion with minimal supervision.6. The ability to communicate effectively (verbal and written) across departments.7. Working knowledge of statistical software tools. Strong MS Excel / Macro skills is a plus.8. Must be comfortable working in a fast-paced environment. Familiar with Lean Manufacturing implementation is a plusEducation or Training: BS/MS degree for Mechanical Engineering, Electrical Engineering, Industrial Engineering or Manufacturing Engineering.
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Details

  • Job Reference: 232034954-2
  • Date Posted: 15 February 2021
  • Recruiter: Fabrinet West
  • Location: Santa Clara, California
  • Salary: On Application
  • Sector: Manufacturing Operations
  • Job Type: Permanent